| 摘要 |
PURPOSE:To obtain sealing epoxy resin composition which is high in temperature cycle resistance, moisture resistance reliability, and high-temperature standing resistance, and hardly causes cracks to a package or troubles at sealing by a method wherein the mixture of resin and filler is previously heated up to a temperature higher than the softening point of the resin component before the mixture is introduced into a kneading device. CONSTITUTION:When epoxy resin composition which contains epoxy resin, hardening agent, hardening promotor, and inorganic filler is manufactured, a resin component of granules or powder and a filler component are mixed together, and the mixture is heated up to a temperature higher than the softening point of the resin. Then, a mechanical shearing force is applied to the mixture heated up to over the softening point of resin to fuse and/or disperse the components by kneading through a kneading device. Then, a kneading operation is stopped when the mixture is put into a pressure moldable state, and the mixture is ground into powder after it is cooled down or molded into tablets. For instance, the mixture of materials compounded at a ratio as indicated on a table is molded into tablets, the tables are heated to a temperature is molded to be softened and then kneaded with a bi-axial mill whose surface temperature is 80 deg.C or so. |
