| 摘要 |
PURPOSE:To prevent a short circuit from occurring between adjacent Au wires in a semiconductor device. CONSTITUTION:Electrodes 5 of a semiconductor pellet 4 fixed to an island 2 of a lead frame through the intermediary of an adhesive agent and lead inner ends 6 are electrically connected together through Au wires 7, where the Au wire 7 is ball-bonded to the electrode 5 first and then stitch-bonded to the lead inner end 6, and on the other hand another Au wire 7 adjacent to the former Au wire 7 is stitch-bonded to the electrode 5 first and then ball-bonded to the lead inner end 6. By this setup, Au wires are alternately bonded through a ball-bonding method and a stitch-bonding method, whereby a previously bonded Au wire is hardly crushed and a short circuit is prevented from occurring between adjacent Au wires even if one of the wires falls down. |
