| 摘要 |
PURPOSE:To enable arrayed optical elements to be mounted on a board simply and with a high accuracy. CONSTITUTION:A junction pad 10 on the rear surface of one of arrayed optical elements is connected with a junction pad 12 of a board via a bump-like connection metal. When reflowing, the optical element is so moved by the surface tension of a bump that the centers of both the pads coincide with each other. Since the relative location of the junction pad 10 to a light emitting or receiving point on the top surface of the optical element is set beforehand accurately, as a result, the optical element is mounted on an accurate location to the board. |
