| 摘要 |
PURPOSE:To provide a semiconductor integrated circuit device capable of incorporating a capacitor functional in place of a chip capacitor in the package as its bypass capacitor by arranging the tab on which mounts a semiconductor chip as one electrode. CONSTITUTION:In a semiconductor integrated circuit device of a package configuration, a semiconductor chip 2 is installed on the main surface of a tab 1 by a bonding member 3. Further, on the reverse side of the tab 1, a metallic foil 5 is adhesively bonded through an insulating film 4 so that the foil becomes a parallel flat plate. The bonding pad of the semiconductor chip 2 and the lead 6 are connected by a bonding wire 7 while the tab 1 or the metallic foil 5 is connected to the lead 6a of the power source terminal or the lead 6b of the grounding terminal by the bonding wires 7a and 7b. Thus, a bypass capacitor of a laminated type is formed by the tab 1, insulating film 4 and metallic foil 5. |
