HERMETISCH ABGESCHLOSSENER HYBRID-FILM-SCHALTUNGSAUFBAU MIT UNBEDECKTEN AKTIVEN BAUSTEINEN UND VERFAHREN ZU DESSEN HERSTELLUNG.

摘要

The present invention relates to hybrid film circuits (CF) having on a first face the passive electronic network (RP) and fixed to the other face the active component(s) made-up of "nake chip(s)" connected to the network on the first face by means of metalized holes, e.g. blind holes (FP1, FP2). The process for the assembling and hermetization of the above mentioned circuits includes substantially the following phases: - Fastening e.g. by welding the film circuit onto the support, e.g. metallic support (SM) - Fastening e.g. by resin or welding etc. the nake active component(s) (CHIP) - Connecting the active component(s) - Hermetization (sealing) of the active component(s) e