Microencapsulated materials are released by rupturing of an adhesive layer on a substrate containing the capsules.
申请公布号
DE3587330(D1)
申请公布日期
1993.06.17
申请号
DE19853587330
申请日期
1985.04.26
申请人
MINNESOTA MINING & MFG. CO., SAINT PAUL, MINN., US
发明人
SWEENY, NORMAN P. C/O MINNESOTA MINING AND;WIENKE, ORVILLE F. C/O MINNESOTA MINING AND;CHARBONNEAU, JACK W. C/O MINNESOTA MINING AND, ST. PAUL MINNESOTA 55133, US
