发明名称 UNIVERSAL SURFACE MOUNT PACKAGE
摘要 A hermetically sealed surface mount electronic component package (10) can be manufactured by converting standard, readily available flat-packs. The package (10) has a base (11), with an opening through which a primary transmission lead (14) extends, a glass-to-metal seal (15) surrounding the primary transmission lead (14) in the opening, and a secondary transmission lead (17) extends from the primary transmission lead (14) so that it is spaced from the base (11) and its end is at least flush with the bottom of the base (11). An insulator (16) can be provided between the primary transmission lead (14) and the secondary transmission lead (17). A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator (16), a secondary transmission lead (17) for connection to the primary transmission lead (14) of the flat-pack, and a connecting member (19) for connecting the insulator (16) and secondary transmission lead (17) to the base (11) of the flat-pack is also described.
申请公布号 CA2057689(A1) 申请公布日期 1993.06.17
申请号 CA19912057689 申请日期 1991.12.16
申请人 ROHDE, META;JOSHI, SHANKAR R. 发明人 ROHDE, META;JOSHI, SHANKAR R.
分类号 H01L23/50;H01L23/10;H05K3/34;H05K7/14 主分类号 H01L23/50
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