| 摘要 |
<p>PURPOSE:To make patterns facing each other only conductive when sticking conductor patterns of a semiconductor module and conductor patterns of a terminal plate for external connection together with an anisotropic conductive film by means of hot gluing. CONSTITUTION:Conductor patterns 2 of a semiconductor module 1 and conductor patterns 6 of a terminal plate for external connection 3 are stuck together, by means of hot gluing, with an anisotropic conductive film 4 formed of insulating hot melt resin and a conductor. In this process of sticking, recesses between the patterns that are adjoining each other, but should be insulated each other, of each of the conductor patterns 2 and 6 are filled with resists 12 and 13 so that the anisotropic conductive film 4 does not flow into such recesses when hot gluing is applied. Therefore, the patterns that are adjoining each other, but should be insulated each other can be prevented from becoming short- circuited.</p> |
