| 摘要 |
A semiconductor device (10) has a multilayer leadframe (14) with two full voltage planes, specifically an upper voltage plane (16) and a lower voltage plane (18). A semiconductor die (12) is mounted to the upper voltage plane. Bond pads (13) of the die are electrically coupled to appropriate leads (20a, 20b, and 20c) using conductive wires (22). Upper voltage plane (16) is provided with at least one opening (28) to allow passage of a conductive wire through the opening in order to electrically couple a bond pad or a lead to lower voltage plane (18). The voltage planes are attached to the leadframe using welded conductive tabs (24), an electrically insulating adhesive layer (26), or both.
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