Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process

摘要

The present invention provides a method for manufacturing a highly reliable semiconductor device without waste by incorporating predetermined functions into a wafer in a wafer completion process, aging the wafer in a wafer aging process, distinguishing between non-defective and defective chips in a probe inspection process, separating chips in the wafer one by one in a dicing process, sorting out the chips into non-defective and defective chips in a selection process, then analyzing failure information and feeding back the result of the analysis to the wafer completion process in a feedback process, thereby quickly analyzing and repairing a failure process on reliability in the wafer completion process.