| 摘要 |
Using an annular rubber seal (6) forms a space between first and second cooling elements (7-12), where a semiconductor device (2) is compound-filled with a sealing compound (16). The cooling elements each have heat sinks (9-12) and metal rails (7,8) to lead heat away directly from the semiconductor device and to make electric contact with the semiconductor device. - An INDEPENDENT CLAIM is also included for a method for producing an electronic power module for an electronic motor control device that permits smooth running in motors. |
