发明名称 PACKAGE STRUCTURE OF PRESSURE SENSOR
摘要 A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate having a diaphragm that is disposed apart from the fixed electrode by a predetermined distance. The support substrate is a silicon/glass composite substrate on which the pressure sensor is mounted such that the support substrate and the diaphragm face each other. The resin layer fixes the pressure sensor and the support substrate together. The pressure sensor is mounted on a mounting area of the support substrate with a joint member therebetween. Accordingly, even if a gap between the support substrate and the diaphragm has a size of about several micrometers, the pressure-sensor package is capable of performing pressure detection with high sensitivity.
申请公布号 US2008087095(A1) 申请公布日期 2008.04.17
申请号 US20070870791 申请日期 2007.10.11
申请人 FUKUDA TETSUYA;WATANABE MITAURU 发明人 FUKUDA TETSUYA;WATANABE MITAURU
分类号 G01L9/12 主分类号 G01L9/12
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