Baking apparatus, substrate heat treatment method and semiconductor device manufacturing method for using baking apparatus, pattern forming method and semiconductor device manufacturing method for using pattern forming method

摘要

A baking apparatus according to one embodiment of the invention includes a hotplate which performs heat treatment to a substrate placed on the hotplate, a base which has at least three support pins passing through through-holes made in the hotplate and supporting the substrate on the hotplate from a backside of the substrate and is vertically movably placed, and a plurality of sensors which are provided at a tip portion of each support pin respectively and sense contact with the substrate. A pattern forming method according to one embodiment of the invention includes forming an antireflection film and a resist film on a substrate to be processed and forming a resist pattern by performing pattern exposing. onto the resist film, baking, and development process (S 01 to S 06 ) measuring a dimension of a predetermined monitor pattern after the formation of the resist pattern (S 07 ), and controlling a heat treatment condition of the resist pattern to deform the resist pattern on the basis of information obtained by measurement of the monitor pattern so that the resist pattern becomes the desired dimension (S 08 -S 13 ).