发明名称 LEAD ALLOY FOIL AND LEAD LAMINATED TAPE USING THE FOIL,BOTH DESIGNED FOR COVERING CABLES
摘要 <p>This invention provides a lead alloy foil comprising 0 to 4 wt % of tin, 0.5 to 7.0 wt % of antimony, and the balance being lead, wherein Sn/Sb ratio is 3 or less. It also provides a lead laminated tape for covering cables, comprising a lead alloy foil comprising 0 to 4 wt % of tin, 0.5 to 7.0 wt % of antimony, and the balance being lead, wherein Sn/Sb ratio is 3 or less, and an electrically conductive plastic film laminated at least one of the surfaces of the lead alloy foil and having a volume resistivity of 106 OMEGA -cm or less.</p>
申请公布号 SG34493(G) 申请公布日期 1993.06.11
申请号 SG19930000344 申请日期 1993.03.29
申请人 FURUKAWA ELECTRIC CO LTD 发明人
分类号 H01B3/00;C22C11/10;H01B7/20;(IPC1-7):C22C11/10;C22C11/08 主分类号 H01B3/00
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