发明名称 |
MANUFACTURE OF CERAMIC MULTILAYERED WIRING BOARD |
摘要 |
PURPOSE:To realize an excellent title board which can be laminated with no phenomema of transfer failure and breakdown of wiring patterns by manufacturing a transfer sheet with much reduced steps generated on an insulting layer by wiring patterns. CONSTITUTION:For screen printing with an insulating paste, a screen printing plate where meshes at points corresponding to wiring patterns 4 formed on a base film 3 are projected to the printing medium side or a screen printing plate where meshes at points corresponding to wiring patterns 4 formed on the base film 3 are projected to the printing medium side further with the line diameter of a mesh of the same point made larger than that of another part are used to manufacture a transfer sheet 7 with much reduced steps. |
申请公布号 |
JPH05145236(A) |
申请公布日期 |
1993.06.11 |
申请号 |
JP19910305868 |
申请日期 |
1991.11.21 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SHIRAISHI SEIGO;OKANO KAZUYUKI;ITAGAKI MINEHIRO;KIMURA RYO |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|