发明名称 MANUFACTURE OF CERAMIC MULTILAYERED WIRING BOARD
摘要 PURPOSE:To realize an excellent title board which can be laminated with no phenomema of transfer failure and breakdown of wiring patterns by manufacturing a transfer sheet with much reduced steps generated on an insulting layer by wiring patterns. CONSTITUTION:For screen printing with an insulating paste, a screen printing plate where meshes at points corresponding to wiring patterns 4 formed on a base film 3 are projected to the printing medium side or a screen printing plate where meshes at points corresponding to wiring patterns 4 formed on the base film 3 are projected to the printing medium side further with the line diameter of a mesh of the same point made larger than that of another part are used to manufacture a transfer sheet 7 with much reduced steps.
申请公布号 JPH05145236(A) 申请公布日期 1993.06.11
申请号 JP19910305868 申请日期 1991.11.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHIRAISHI SEIGO;OKANO KAZUYUKI;ITAGAKI MINEHIRO;KIMURA RYO
分类号 H05K3/46 主分类号 H05K3/46
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