| 摘要 |
<p>PURPOSE:To provide a reliable method of soldering SMD leads on a printed circuit board, in which leads are firmly soldered to prevent separation. CONSTITUTION:A printed circuit board 9 has solder-plated pads 7 each having a longitudinal recess, and an SMD is placed with ends 3 of its leads 2 received in the recesses of the corresponding pads. The SMD leads are connected to the pads on the board by reflow soldering.</p> |
