| 摘要 |
<p>PURPOSE:To provide the production of a semiconductor device which accurately and surely connects electrically an semiconductor element, which stores an outer lead terminal by surely and firmly bonding it on the wiring conductor of an external electric circuit board, on the wiring conductor of the external electric circuit board. CONSTITUTION:A semiconductor device is provided with a semiconductor element 4 which is stored in a container 3 whose external surface is provided with an outer lead terminal 5 and the electrode of the semiconductor element 4 is electrically connected to the outer lead terminal 5. Then, the surface of the outer lead terminal 5 of the semiconductor device is coated with a metal layer 8 composed of tin, the outer lead terminal 5 is bent by a pressing machine P and solder 9 is deposited on the surface of the outer lead terminal 5. The outer lead terminal 5 is easily bent in the prescribed shape without being caught by the pressing machine by the metal layer composed of tin which allows smooth slide.</p> |
