CONDUCTIVE PASTE COMPOSITION

摘要

PURPOSE:To provide both a conductive paste composition giving conductor of low thermal expansion property without damaging the electric resistance thereof and a novel multilayer ceramic circuit substrate prepared through the process of using the composition CONSTITUTION:A conductive paste composition is characterized in that electric resistivity for a conductor is not more than 15.0OMEGAcm and the thermal expansion coefficient thereof is not more than 13.0X10<-6>/ deg.C, and more concretely paste consists mainly of copper containing 10 to 50wt.% of tungsten and/or molybdenum and 0 to 30wt% of a glass component. A conductor is accordingly formed out of such composition, and a ceramic circuit substrata comprises the conductor and an insulating layer laminated together.