| 摘要 |
PURPOSE:To improve the reliability of the electrical connection of an electromagnetic shielding layer and signal circuit layer and further to give a board high bending properties by partially removing an adhesive layer and by forming the signal circuit layer and electromagnetic shielding layer into an unbonded structure in the partially removed part. CONSTITUTION:One side FPC for signal circuit layer A is made when a polyimide cover-lay 2 with adhesive is laminate-bonded onto the copper foil 4 of one side-coppered polyimide base material 1. An electromagnetic shielding layer B is formed when one side-coppered polyimide base material 8 with a copper foil 9 directed to the outside is bonded by an adhesive layer 12 to both sides of the signal circuit layer A. An opening is formed in time suitable part of a bonded sheet to be used. This bonded sheet is laminated to the rear surface of the polyimide resin layer of the one side-coppered polyimide base material 8. Then, after the one side-coppered polyimide base material 8 with the laminated bonded sheet is put on and bonded to the signal circuit layer A, through-hole plating is applied thereto. |
