MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a method of improving sealing up of a semiconductor chip with resin, where cracks are prevented from occurring in the sealed semiconductor chip. CONSTITUTION:In a semiconductor device manufacturing method where a process through which a semiconductor chip 3 is mounted on a die stage 2 of a lead frame 1 and sealed up with resin is provided, a spherical insulator 9 which envelops the center of the lead frame 1 where the semiconductor chip 3 is mounted is previously formed before a resin sealing process is carried out.