| 摘要 |
<p>PURPOSE: To manufacture an electrically separated module-type multilayer wiring structure body by a method, wherein respective layers are separated at little gaps, to be filled up with insulating materials made of SiO2 , Si3 N4 or composite material or air. CONSTITUTION: The upper part of a structured body is composed of the laminated parts of a unit 17, while a topmost layer 16 is made of another unit 16 supporting face contact pads which are arrayed so as to correspond to respective integrated circuits 21, so that recesses may be formed on the sides of the substrate due to the slipped off interlayer positions. Within the recesses, specific shaped units 18 may be used if necessary, or one of them 18 may be used as a female part of a plug-in system or the other corresponding inserted parts 19 may be substituted for a wiring network. That is, the lower part is made of a second laminated layer set, i.e., sub-unit parts. Furthermore, the underside of the multilayer substrate having a plurality of contact pins 20, the lower layers and the unit parts display mechanical stability, so that various types of multilayer mutual wiring structured bodies may be realized softly and at low cost.</p> |
