| 摘要 |
<p>PURPOSE:To obtain the thin film laminated device which is light in weight, low in cost and is free from film peeling, cracking and substrate curling by providing polymer coatings at the cracking points existing in 1st and 2nd inorg. material layers. CONSTITUTION:This device is constituted by the 1st inorg. material layer 2a which is a thin film consisting of an inorg. material on one surface of a substrate 1 and the 2nd inorg. material layer 2b which is a thin film consisting of an inorg. material on the other surface and providing the polymer coatings at the cracking points existing in the 1st and 2nd inorg. material layers 2a, 2b. Thermosetting or photosetting polymers are preferable as the polymers to be used. An epoxy resin having the excellent resistance to alkalis, acids, etc., is more particularly preferable. The inorg. materials constituting the 1st and 2nd inorg. material layers 2a, 2b are exemplified by the thin films, etc., of inorg. materials, such as SiO2 and SiO or SiO:F, SiO2:F, etc., which are silicon compds. contg. fluorine formed by a sputtering method, vapor deposition method, plasma CVD method, etc.</p> |
