Package with reinforced structure for an integrated circuit, and card comprising such a package

摘要

The invention relates to the protection of integrated circuits intended to be mounted in devices such as cards in which they must not create excess thickness. It consists in reinforcing the integrated circuit (101) with at least one reinforcing armature (107) formed by a rigid and strong plate buried in the material (106) usually forming the integrated circuit package. This reinforcing armature is preferably manufactured from a silicon chip, according to the techniques used for manufacturing the integrated circuits. It makes it possible to reinforce the protection of the integrated circuits used in "chip cards" and thus to enhance the reliability of the latter.