发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable high precision working and improve yield, by leaving a silicon nitride film in a recess, in order to discriminate a side contact part out of side walls of a trench formed in an Si substrate from a part for forming an oxide film for capacitor isolation which film electrically isolates a first electrode from the silicon substrate. CONSTITUTION:A silicon nitride film 21 is deposited on a diffusion layer 4 for connection on which a recess is formed, and left in the recess of the layer 4 by anisotropically etching the film 21 and an oxide film 2 for element isolation. A trench is formed in an Si substrate 1 by using a first oxide film 5 as mask material, and an oxide film 6 for capacitor isolation is formed on the side surface and the bottom surface. The silicon nitride film 21 left in the recess is selectively eliminated. Conductive material is deposited in the trench, anisotropically etched, left on the side wall part of the trench, and turned into a first electrode. A capacitor dielectric film, a second electrode, and a second oxide film are deposited in order. Unnecessary parts of the first oxide film 5 are eliminated, and the Si substrate 1 is exposed, thereby completing a capacitor part.
申请公布号 JPH05145034(A) 申请公布日期 1993.06.11
申请号 JP19910308718 申请日期 1991.11.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 AKAZAWA MORIAKI;ISHIDA TOMOAKI;MUKAI TAKAO
分类号 H01L21/76;H01L21/822;H01L21/8242;H01L27/04;H01L27/10;H01L27/108 主分类号 H01L21/76
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