摘要 |
A light emitting device and a method for producing the same are provided to prevent light leakage by installing a metal-reflecting plate in a light-irradiating direction of an LED chip. An LED chip(501) is mounted on a substrate(506). An insulating part(509) is composed of a light transmitting resin formed on a surface of the substrate. The insulating part includes a light-reflecting filler addition region having a light-reflecting filler and a light-reflecting filler non-addition region without the light-reflecting filler. A first metal part is formed on a mount surface of a substrate. A second metal part is electrically insulated with the first metal part and is formed on the mount surface of the substrate. An LED chip is mounted on the first metal part and is electrically connected to the first metal part and the second metal part. A metal-reflecting plate(502) and the first metal part are formed with one body in order to surround the mount surface. The metal-reflecting plate is formed to reflect the light of the LED chip and to induce the light to a light-irradiating surface. A transparent sealing body(510) is formed to seal up the LED chip. The insulating part is composed of a resin including a light-reflecting filler and is formed to surround a periphery of the second metal part within a region surrounded with the metal reflecting plate.
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