发明名称 Method for laminating substrate with film and laminator.
摘要 <p>In a method for laminating a single side surface of a flexible, thin substrate (11) with a film (39), a substrate is transported to a position in front of a pair of lamination rollers (17) and stopped at that position. One side surface of a front end portion of the substrate is held by suction on a suction block (61) so that the front end portion of the substrate is maintained in a substantially flat position. A film is tack-attached to the other side surface of the front end portion of the substrate. After completion of tack attachment of the film to the substrate, the substrate is driven into a nip defined by the pair of lamination rollers, whereby the substrate is laminated with the film.</p>
申请公布号 EP0544977(A1) 申请公布日期 1993.06.09
申请号 EP19920102619 申请日期 1992.02.17
申请人 HAKUTO CO., LTD.;SANEI GIKEN CO., LTD. 发明人 MIYAKE, EIICHI
分类号 B29C65/20;B29C65/78;B29L9/00 主分类号 B29C65/20
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