| 摘要 |
<p>PURPOSE:To enhance adhesion between a module and a card base board in an IC card. CONSTITUTION:The construction of an IC card is such that a wiring board 5 is fitted in a recess 25 formed in a card base board 2 and a joining surface 12 of the board 5 extending beyond the package 11 of a module is bonded to a joining surface 26 of the stepped surface of the recess of the card base board through adhesive material 27, while a plurality of protruding adhesive reinforcements 15 are provided at the joining surface of the module. As a result, the bonding and engaging area between the reinforcements 15 and the material 27 is increased, so that the module 3 is firmly fixed to the card base board 2.</p> |
