Electronic module of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The modules are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each module, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.
申请公布号
US5218516(A)
申请公布日期
1993.06.08
申请号
US19910786232
申请日期
1991.10.31
申请人
NORTHERN TELECOM LIMITED
发明人
COLLINS, HUGH M.;HAYES, HASLER R.;MOSS, JOHN S.;READ, CLIFFORD D.;NICOLETTA, TRISTANO F.;DRAYTON, JOHN B.;PELL, DAVID J.;KATCHMAR, ROMAN