发明名称 |
Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith |
摘要 |
A solder composition includes a reflow-wetting element that is an intermetallic both pre-reflow and post-reflow. The intermetallic releases the reflow-wetting element upon heating. The solder composition includes the intermetallic first phase in a bulk-solder second phase. A method of assembling a microelectronic package includes the intermetallic in a solder. A computing system also includes the intermetallic first phase in the bulk-solder second phase.
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申请公布号 |
US7578966(B2) |
申请公布日期 |
2009.08.25 |
申请号 |
US20050173224 |
申请日期 |
2005.06.30 |
申请人 |
INTEL CORPORATION |
发明人 |
SUH DAEWOONG |
分类号 |
B23K35/22;B23K35/24;B23K35/26;B23K35/28;C22C28/00 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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