| 摘要 |
The process according to the invention makes it possible to manufacture a memory card comprising a body (1) provided with an integrated circuit (3) including pins (4, 4a) which are connected electrically to read/write contacts (9, 9a) by conductors (8, 8a). It consists in depositing a layer of dielectric varnish (6) on the integrated circuit (3), other than on the pins thereof, in fashioning a cavity (2) in the body (1), in providing the latter with a conduction region (5) situated partly inside and partly outside the cavity, in applying the layer (6) against an adhesive strip (7, 7a), in introducing the integrated circuit (3) into the cavity (2), in applying the free part of the adhesive strip (7, 7a) to the body (1) of the card, in forming the read/write contacts (9, 9a) and the conductors (8, 8a) by depositing a conductive ink on the adhesive strip (7, 7a), which allows electrical links between the pins (4, 4a) and the conductors (8, 8a) as well as between the conduction region (5) and one (8a) of the said conductors, and in forming a second layer of dielectric varnish (10) on the adhesive strip and on the assembly, other than on the read/write contacts (8, 8a). <IMAGE>
|
