HOT MELT ADHESIVE COMPOSITION

摘要

The hot melt adhesive compsn. is composed of (a) an ethylene vinyl acetate copolymer, (b) a modified epoxy resin, (c) an organic phosphoric acid ester of formula (I) [R1=R2=R3=C1-8 alkyl , (d) naphthenic oil, (e) a rosin ester, (f) a crystalline wax, and (g) a phenolic antioxidant. The modified epoxy resin is produced by reacting 50-70 wt.% bisphenol-A epoxy resin, 20-40 wt.% polybutadiene acrylonitrile copolymer and 5-15 wt.% bisphenol-A in the presence of an organic phosphine catalyst. The compsn. has an adhesion-durability at a high temp.