| 摘要 |
A method and apparatus for bonding external leads of a solid state device to a lead frame, where a positional discrepancy between the solid state device and the lead frame is corrected not only in X-Y directions but also in the rotational direction so as to perform a high accuracy bonding. Discrepancies in the rotational direction are calculated after detecting two points of the solid-state device, and a sunction head holding such solid-state device is rotated to correct such discrepancy. One portion of the solid-state device is further detected and the discrepancy in X-Y direction is calculated so as to correct the relative positional discrepancy of the solid-state device and the lead frame. |
