| 摘要 |
A wafer test method is disclosed. The method includes the steps of: acquiring a wafer image by photographing a wafer including multiple semiconductor dies; performing pass or fail judgment on the semiconductor dies by comparing the semiconductor dies with a reference image; generating a wafer map using the judgment result; comparing die arrangement of the generated wafer map with die arrangement of a reference wafer map; and stopping a test process in a case when the die arrangement of the generated wafer map is different from the die arrangement of the reference wafer map, base on the comparison result. The wafer test method can improve test reliability as to the semiconductor dies. |
