| 摘要 |
PURPOSE:To achieve the high lamination of a hybrid integrated circuit substrate and to achieve the high-density mounting operation of a chip by a method wherein a recessed hole is made on the surface of the hybrid integrated circuit substrate composed of a derivative material and the inside of the recessed hole is covered with a metal film. CONSTITUTION:A plurality of recessed holes 2 are made on a hybrid integrated circuit substrate 1; the holes 2 are formed to be deeper than the thickness of chips to be mounted. The inside of each hole 2 is covered with a metal film 3. When the hybrid integrated circuit substrate 1 is used, a chip 4 does not protrude on the substrate. Since the connection part of the chip 4 becomes lower than the position of the connection part of the hybrid integrated circuit substrate 1, bonding wires 5 which are used to connect the hybrid integrated circuit substrate 1 to the chip 4 are not bent at the upper part of the hybrid integrated circuit substrate 1. Thereby, the high lamination of the hybrid integrated circuit substrate and the high density of the chip can be achieved. |
