| 摘要 |
<p>PURPOSE: To prevent the generation of unwanted conduction between lower inner conductive layers, even under a load of thermal stress on a thick film multilayer ceramic substrate by forming a solder layer with a screen printing glass ceramic C paste on the region which is surrounded by a film layer covering the conductive layer. CONSTITUTION: In a thick-film multilayer ceramic substrate in which a conductive layer 12 is provided on a surface dielectric layer 11, the conductive layer 12 and a functional part 15 are connected through a solder layer 14 formed on the conductive layer 12, a coated layer 13, consisting of unwettable by solder material covering the conductive layer 12 along a circumference 121 of the conductive layer, is provided, and a solder layer is formed in the region surrounded by the coated layer 13. It is preferable that the coated layer 13 cover the circumferential part 12 of the conductive layer, at least in a width of 20μm from the circumference 121 of the conductive layer. Also, it is preferable that the conductive layer 12, which is covered by the coated layer 13, have at least a thickness of 5μm. Consequently, there is no contact part between the solder layer 14 and the surface dielectric layer 11, so that the dielectric layer 11 is no longer destroyed, even when it is under the load of thermal stress.</p> |
