| 摘要 |
An age-hardening type special Cu alloy prepared by compounding 0.1 to 5% by weight of Ni, 0.01 to 7% by weight of Si, 0.01 to 10% by weight of Fe, 0.01 to 7% by weight of Ti and 0.001 to 1% by weight of B in Cu as the main component. This alloy is improved in the electrical conductivity, heat-conductivity and mechanical properties such as, in particular, the hardness and resiliency compared to the hitherto known alloys, and is useful for electronic parts.
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