| 摘要 |
PURPOSE: To obtain a method for preventing, for example, a harmful deposit from being generated by a method for provide a solder bump that is used in a flip-chip junction technique. CONSTITUTION: A part features the inclusion of a stage, where a solderable pad 54 is provided on a substrate surface such as silicon that does not wet to solder, a solder element 58 is limitedly adhered onto the pad 54, so that it becomes the inside of the peripheral edge part of the pad. A device is heated to re-melt the solder and the solder is allowed to flow to the edge part of the pad 54 that can be wetted for covering an entire part, and a device is cooled for forming a bump 59. The solderable pad 54 is formed by a layer that is adhered by the continuation of, for example, Ti, Pt, and Au. |
