MANUFACTURE OF SEMICONDUCTOR DEVICE AND RESIN-SEALING METAL MOLD

摘要

PURPOSE:To obtain a method for preventing unfilled parts and voids and to obtain a resin-sealing metal mold used for executing the method by forming a resin reservoir at the turning point of a resin runner at the resin-sealing metal mold. CONSTITUTION:Resin reservoirs 8 are formed at turning points of resin runners 5 which supply a resin to individual semiconductorchip housing parts 3 form a resin introduction part 7. A resin which has been pressed into the resin introduction part 7 is once filled into the resin reservoirs 8; it is then distributed to the resin runners 5 leading to the semiconductor-device chip housing parts 3. As a result, the difference in the filling start time to the individual semiconductor-device chip housing parts 3 is shortened and a filling operation is started nearly simultaneously. Thereby, it is possible to reduce unfilled parts voids.