| 摘要 |
PURPOSE:To increase the mounting density of a circuit part by a method wherein the ratio occupied by the circuit part to the volume of a device as a whole is increased. CONSTITUTION:A semiconductor chip 1 is wire-bonded to only leads 4b in one row. It is not wire-bonded to leads 4a in the other row. A wide space used to stretch wires 5 is required between the semiconductor chip 1 and the leads 4b. A space between the semiconductor chip 1 and the leads 4a can be made narrow because it is not required to stretch any wire. A package 17 can be made small by the portion. Thereby, the ratio occupied by the semiconductor chip 1 is increased relatively, and the mounting density of a circuit part can be increased.
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