| 摘要 |
PURPOSE:To make it possible to replace easily even a defective component of small electronic components mounted on a board at a high density for a nondefective component without generating a secondary defect in other components. CONSTITUTION:A board 18 is positioned and placed on a table 16, the table 16 is moved in X-Y directions by motors 12 and 15 and the position of a defective component 27 on the substrate 18 is detected by a CCD camera 28. Then, the table 16 is moved from this position to a repair process, a laser beam is emitted on the defective component 27 via an optical fiber 26 to melt solder in a non-contact state and the component 27 is held by a suction nozzle 25 and is removed. In the same way, a nondefective component 29 is mounted at a repair place. |
