| 摘要 |
PURPOSE:To prevent electromagnetic waves from leaking out from a case through an opening provided to its back cover and electrostatic troubles by a method wherein an SG layer and an FG layer are formed on both sides of a shield wiring board as isolated from each other. CONSTITUTION:An SG film 16 is formed on the inner side of a shield wiring board 15 set on the rear side of a back board 4, and an FG layer 17 is formed on the opposite side of the shield wiring board 15. A contact spring 19 is interposed between the back board 4 and the shield wiring board 15 in the region of bias holes 14 to electrically connect the SG layer 16 formed on the shield wiring board 15 with the bias hole 14. A grounding pin 8 is made to come into contact with the SG layer 16 through a through-hole 20 provided to the shield wiring board 15. By this setup, the inner SG layer of a back board is electrically connected to the SG layer 16 of the shield wiring board 15. Therefore, a shield structure of this design induces the same effect that an inner SG layer is formed outside of the back board 4, so that it can be enhanced in shield effect. |
