| 摘要 |
PURPOSE:To acquire a semiconductor device of good humidity-proof reliability and formation operativity by resin-sealing a semiconductor element by using a special epoxy resin composition which contains specific biphenyl epoxy resin and silica powder having specific grain distribution at a specific rate. CONSTITUTION:A semiconductor device which is formed by sealing a semiconductor element by using an epoxy resin composition which contains biphenyl epoxy resin expressed by the formula (R is hydrogen atom or methyle group and (n) is 0 or a positive integer), curing agent and silica powder whose content is set at 60 to 90wt.% of an entire of epoxy resin composition. As for the silica powder, grain diameter of 149mum or more is 0.5wt.% or less, grain diameter of 44mum or less is 60wt% or more, grain diameter of 5mum or less is 20 to 45wt.% and has grain distribution at a median diameter exceeding 5mum to 25mum or less. Therefore, the acquired semiconductor device has good humidity resistance and formation operativity due to burr characteristics. |
