| 发明名称 |
APPARATUS AND PROCESS OF ELECTRO-CHEMICAL PLATING |
| 摘要 |
An electro-chemical plating process begins with supplying a supercritical fluid into an electroplating solution to be deposited, and a bias is applied between a substrate and an electrode, which is located in the electroplating solution. The substrate is placed into the electroplating solution to deposit a material on the substrate. |
| 申请公布号 |
US2016177467(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414581876 |
申请日期 |
2014.12.23 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHANGCHIEN Ying-Hsueh;LEE Yu-Ming;YANG Chi-Ming |
| 分类号 |
C25D21/06;C25D21/02 |
主分类号 |
C25D21/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electro-chemical plating (ECP) process, comprising:
supplying a supercritical fluid into an electroplating solution to be deposited; applying a bias between a substrate and an electrode, wherein the electrode is located in the electroplating solution; and placing the substrate into the electroplating solution to deposit a material on the substrate. |
| 地址 |
HSINCHU TW |
