| 摘要 |
PURPOSE:To perform a resin sealing operation in such a way that the air is not stored inside a sealed resin by a method wherein a resistance means which controls the flow of the resin is installed at a cavity part. CONSTITUTION:Protruding parts 10, 10,... are arranged at prescribed intervals, according to an injection method, in parts where the fluidity of a resin to be injected becomes high, i.e., in parts where a sealed resin becomes thick. When the resin is sealed by using such a metal mold for semiconductor-element resin sealing use, the fluidity of the resin to be injected in parts where the fluidity becomes high, i.e., in parts on the side of leads where the sealed resin becomes thick is lowered by the protruding parts 10, 10,.... Thereby, the fluidity can be made nearly the same as the fluidity of the resin in the parts where the fluidity of a resin to be injected originally is low, i.e., the fluidity of a resin in a part where a semiconductor element is situated. As a result, the fluidity of the resin excluding cavity parts 3 can be made nearly uniform. |
