IN LINE TYPE SUBSTRATE PROCESSING SYSTEM USING POWER SPLITTER

摘要

The present invention relates to an in-line substrate processing system using a power splitter. The in-line substrate processing system using a power splitter includes: a plurality of processing chambers which are connected in an in-line manner, and perform a plasma process on a supplied substrate to be processed; a plurality of capacitive coupling electrodes which are placed in the processing chambers and discharge capacitive coupled plasma into the processing chambers; and a power splitter which distributes power to each capacitive coupling electrode. The in-line substrate processing system using a power splitter can uniformly discharge the large-area plasma with high density as power is uniformly distributed to the capacitive coupling electrodes using the power splitter. Also, the present invention can improve the plasma discharge efficiency of the processing gas and reduce the amount of particles generated during the process. Furthermore, parasitic discharge can be minimized since the plasma process is stable, and impedance matching can be performed through the power splitter.