| 摘要 |
A target structure is provided for use in a magnetically enhanced diode sputter coating source having a sputtering target which at end-of-life has an eroded surface with a known shape. The sputtering target has a non-sputtered profiled back surface conforming substantially in shape to the eroded surface at end-of-life. A backing plate is bonded to the sputtering target which has a bonding surface complementary to the non-sputtered back surface of the sputtering target and is designed to mate therewith. A method is provided for fabricating the target structure and bonding the sputtering target to the backing plate by isostatic pressing.
|
