| 摘要 |
The objective of the present invention is to provide a power chip stacked package by using clips. The present invention provides a stacked package comprising: a first power chip which is coupled to an upper part of a pad portion of a lead frame comprising a pad portion, a first lead portion and a second lead portion which are separated from one another by predetermined distance; a first clip containing a first chip contact portion of which a lower surface is coupled to an upper surface of the first power chip, and which protrudes toward the first power chip so that a first chip insertion groove can be provided on an upper surface of the first chip contact portion, and a first downset portion coupled to the first lead portion, and a first connection portion connecting the first contact portion and the first downset portion; a second power chip which is coupled by inserting a lower end part thereof into the first chip inserting groove of the first chip contact portion; and a second clip coupled on an upper surface of the second power chip. |
