| 摘要 |
PURPOSE:To enable the flip chip mounting of a semiconductor chip with simple process by connecting the electrode of a wiring board with a bare chip, by thermocompression bonding, at the bonding temperature in the solid phase region not more than the fusing point of a solder bump. CONSTITUTION:In a flip chip mounting where a semiconductor chip 21 is mounted directly on a wiring board 26 through a bump 24, a solder wire, which does not have eutectic composition, is used as bump formation method. And, a solder ball bump 24 is made directly on the electrode pad of the semiconductor chip 21. The flip chip mounting by thermocompression is performed at the bonding temperature not more than the fusing point of the solder ball bump 24 to the wiring board 26 where a conductor electrode 25 is made. Hereby, the flip chip mounting of the semiconductor chip becomes possible by simple process. |
