发明名称 Substrate holding mechanism, substrate transporting device, and semiconductor manufacturing apparatus
摘要 A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.
申请公布号 US9378997(B2) 申请公布日期 2016.06.28
申请号 US201514670749 申请日期 2015.03.27
申请人 EBARA CORPORATION 发明人 Nishida Hiroaki
分类号 H01L21/687 主分类号 H01L21/687
代理机构 Pearne & Gordon LLP 代理人 Pearne & Gordon LLP
主权项 1. A substrate holding mechanism comprising: a substrate holding claw for holding the substrate, wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being increased from the inside of a space for holding the substrate toward the outside of the space, wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face, and wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.
地址 Tokyo JP