发明名称 |
Substrate holding mechanism, substrate transporting device, and semiconductor manufacturing apparatus |
摘要 |
A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face. |
申请公布号 |
US9378997(B2) |
申请公布日期 |
2016.06.28 |
申请号 |
US201514670749 |
申请日期 |
2015.03.27 |
申请人 |
EBARA CORPORATION |
发明人 |
Nishida Hiroaki |
分类号 |
H01L21/687 |
主分类号 |
H01L21/687 |
代理机构 |
Pearne & Gordon LLP |
代理人 |
Pearne & Gordon LLP |
主权项 |
1. A substrate holding mechanism comprising:
a substrate holding claw for holding the substrate, wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being increased from the inside of a space for holding the substrate toward the outside of the space, wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face, and wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face. |
地址 |
Tokyo JP |