| 摘要 |
PURPOSE:To provide manufacturing method of chip-type electronic parts which have no deterioration pertinent to a conductor due to plating liquid or water, and are excellent in soldering heat resistance and soldering performance. CONSTITUTION:A condenser is formed on an aluminum substrate, and then a conductor which is connected to the condenser and extends to an edge of a substrate is formed on the aluminum substrate. By exposing the some part of the conductor positioned close to an edge of the substrate, the conductor and the condenser are covered with overcoat. In addition, after coating the exposed portion of the conductor and the edge of overcoat with the use of conductive paste having plating liquid resistance, an external electrode is installed on the edge of the substrate by barrel plating, so that the external electrode can cover the conductive paste. |
